アメリカの半導体素子標準規格を策定する団体・JEDECが、ノートパソコン用メモリモジュールの新しい規格となるCompression ...

米Micronは1月9日（現地時間）、LPDDR5Xメモリをベースに、優れた電力効率と省スペース性を兼ね備えたメモリーモジュール、LPCAMM2(low-power compression attached memory module）の提供を開始した。ノートPCや小型フォームファクタのデスクトップPCに、優れた転送速度と ...

ARLINGTON, Va., October 20, 2025--(BUSINESS WIRE)--JEDEC® Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is ...

BOISE, Idaho, Jan. 09, 2024 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (MU), today unveiled the industry’s first standard low-power compression attached memory module (LPCAMM2) available in ...

DRAMのメモリモジュール規格「DIMM」に代わる「CAMM」が採用され始めている。CAMMはDIMMとは何が違うのか。メモリモジュール進化の変遷を踏まえて解説する。 DIMMがまだ新しい技術に取って代わられていないのは、少々驚きだ。DIMMは、コンピュータ会社Wang ...

Micron Technology has started customer sampling of its new 192GB SOCAMM2 (Small Outline Compression Attached Memory Module), a low-power DRAM module designed for AI data centers. Save my User ID and ...

Nvidia has reportedly tapped Micron Technology as the first supplier of its next-generation small outline compression attached memory module (SOCAMM) chips, putting the US-based memory maker ahead of ...

JEDEC, an organization that formulates semiconductor device standards in the United States, has announced that it will standardize Compression Attached Memory Module (CAMM2), a new standard for memory ...

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According to The Korea Economic Daily, Micron has received Nvidia’s approval for mass production of SOCAMM (small outline compression attached memory module), a new type of high-performance, low-power ...